Electronics

Simultaneously disperse conductive or insulative powders into resins, homogenize, and de-air.

Precise material mixing is vital for producing high-performance, electrically conductive coatings and solder paste.

FlackTek™’s innovative bladeless, dual asymmetric centrifugal mechanism offers faster and more effective homogenization than traditional methods, benefiting manufacturers of thermally conductive/insulative silicones, epoxy resins, metal powder systems for solder paste, and formulations like epoxies, polyurethanes, parylene, and acrylics used in conformal coatings.

Benefits Include:

Precision Mixing for Electronic Materials: FlackTek™ technology delivers thorough and uniform mixing essential for high-performance electronic applications.

Elimination of Air Bubbles: Ensures air-free mixtures, which is critical for the conductivity and reliability of electronic components.

Temperature Control Capabilities: Advanced models offer precise temperature regulation to protect heat-sensitive materials during the mixing process.

Non-Contaminating Mixing Environment: Disposable containers prevent cross-contamination, maintaining the purity of sensitive electronic formulations.

Versatile Batch Processing: Accommodates a wide range of batch sizes, suitable for both prototype development and large-scale manufacturing.

Homogeneous Dispersion of Conductive Fillers: Achieves uniform distribution of conductive particles, enhancing electrical properties and product performance.

We Can Help You Process:

Conductive Inks (e.g., silver, copper-based formulations)

Solder Pastes

Thermal Interface Materials (e.g., conductive greases, gels)

Encapsulants and Potting Compounds

Adhesives and Sealants for Electronics

Dielectric Materials

Nanomaterials for Electronic Applications

Printed Circuit Board (PCB) Resins

Silicone Elastomers

EMI Shielding Materials

Common Challenges and Solutions

loader-icon

The Challenge: Chief among major challenges in mixing formulations for electronics is the amount of time and labor it takes to prepare and formulate slurries, pastes, binders, and other solutions and the immense difficulty of achieving homogenous results consistently and repeatably.

The Solution: FlackTek™ offers a high-speed mixing technology that significantly reduces the time and labor required for preparing and formulating slurries, pastes, binders, and other solutions. The FlackTek™ efficiently blends and disperses materials within minutes, streamlining the formulation process.

The Challenge: The ability to disperse powders into slurries or pastes with varying concentrations and materials densities.

The Solution: The FlackTek™ excels at dispersing powders into slurries or pastes, achieving excellent homogeneity even with varying concentrations and materials densities. This capability ensures uniform dispersion of powders and enhances the quality and performance of electronic components.

The Challenge: Improper mixing can result in dispersed fillers and additives settling over time.

The Solution: FlackTek™ minimizes settling issues by achieving thorough and consistent dispersion. The high-energy mixing action helps prevent the settling of dispersed fillers and additives, ensuring long-term stability and performance of the formulations.

Frequently Asked Questions

What advantages does FlackTek™ offer over traditional mixing methods in the electronics industry?

Unlike conventional mixers, the FlackTek™ is non-invasive and requires no blades, minimizing the risk of contamination and simplifying cleaning procedures. Additionally, its high-speed mixing action achieves rapid dispersion, homogeneous blending that’s perfectly repeatable, and efficient wetting of materials, resulting in superior product quality, reduced processing time, and increased manufacturing efficiency.

How can I solve the challenges of settling and agglomeration of materials in electronic formulations?

FlackTek™ effectively addresses the challenges of settling and agglomeration in electronic formulations. Its high shear dual asymmetric mixing results in thorough dispersion, preventing the settling of conductive fillers and additives over time. By achieving uniform dispersion and breaking down agglomerates, FlackTek™ helps maintain the stability, reliability, and performance of electronic formulations throughout their lifespan.

Can FlackTek™ accommodate the mixing of dissimilar materials, such as incompatible resins and fillers, in electronic formulations?

Yes! FlackTek™ is suitable for mixing dissimilar materials commonly encountered in electronic formulations. The centrifugal mixing action creates a dynamic process that facilitates the blending and dispersion of materials with varying densities, leading to uniform distribution throughout the formulation. As a result, the FlackTek™ eliminates density-related inconsistencies and produces high-quality electronic materials.

Need help optimizing your process?