Electronics

Simultaneously disperse conductive or insulative powders into resins, homogenize, and de-air.

Connect with a Mixing Specialist

Precise material mixing is vital for producing high-performance, electrically conductive coatings and solder paste.

FlackTek™'s innovative bladeless, dual asymmetric centrifugal mechanism offers faster and more effective homogenization than traditional methods, benefiting manufacturers of thermally conductive/insulative silicones, epoxy resins, metal powder systems for solder paste, and formulations like epoxies, polyurethanes, parylene, and acrylics used in conformal coatings.

Benefits include

  • Precision Mixing for Electronic Materials

    FlackTek™ technology delivers thorough and uniform mixing essential for high-performance electronic applications.

  • Elimination of Air Bubbles

    Ensures air-free mixtures, which is critical for the conductivity and reliability of electronic components.

  • Temperature Control Capabilities

    Advanced models offer precise temperature regulation to protect heat-sensitive materials during the mixing process.

  • Non-Contaminating Mixing Environment

    Disposable containers prevent cross-contamination, maintaining the purity of sensitive electronic formulations.

  • Versatile Batch Processing

    Accommodates a wide range of batch sizes, suitable for both prototype development and large-scale manufacturing.

  • Homogeneous Dispersion of Conductive Fillers

    Achieves uniform distribution of conductive particles, enhancing electrical properties and product performance.

We can help you process

  • Conductive Inks (e.g., silver, copper-based formulations)
  • Solder Pastes
  • Thermal Interface Materials (e.g., conductive greases, gels)
  • Encapsulants and Potting Compounds
  • Adhesives and Sealants for Electronics
  • Dielectric Materials
  • Nanomaterials for Electronic Applications
  • Printed Circuit Board (PCB) Resins
  • Silicone Elastomers
  • EMI Shielding Materials

Common challenges and solutions

Processing Time

The challenge

Chief among major challenges in mixing formulations for electronics is the amount of time and labor it takes to prepare and formulate slurries, pastes, binders, and other solutions and the immense difficulty of achieving homogenous results consistently and repeatably.

The solution

FlackTek™ offers a high-speed mixing technology that significantly reduces the time and labor required for preparing and formulating slurries, pastes, binders, and other solutions. The FlackTek™ efficiently blends and disperses materials within minutes, streamlining the formulation process.

Without FlackTek Processing Time — before mixing with a FlackTek
With FlackTek Processing Time — after mixing with a FlackTek
Agglomerations

The challenge

The ability to disperse powders into slurries or pastes with varying concentrations and materials densities.

The solution

The FlackTek™ excels at dispersing powders into slurries or pastes, achieving excellent homogeneity even with varying concentrations and materials densities. This capability ensures uniform dispersion of powders and enhances the quality and performance of electronic components.

Without FlackTek Agglomerations — before mixing with a FlackTek
With FlackTek Agglomerations — after mixing with a FlackTek
Shelf Life

The challenge

Improper mixing can result in dispersed fillers and additives settling over time.

The solution

FlackTek™ minimizes settling issues by achieving thorough and consistent dispersion. The high-energy mixing action helps prevent the settling of dispersed fillers and additives, ensuring long-term stability and performance of the formulations.

Without FlackTek Shelf Life — before mixing with a FlackTek
With FlackTek Shelf Life — after mixing with a FlackTek

Frequently asked questions

What advantages does FlackTek™ offer over traditional mixing methods in the electronics industry?

Unlike conventional mixers, the FlackTek™ is non-invasive and requires no blades, minimizing the risk of contamination and simplifying cleaning procedures. Additionally, its high-speed mixing action achieves rapid dispersion, homogeneous blending that’s perfectly repeatable, and efficient wetting of materials, resulting in superior product quality, reduced processing time, and increased manufacturing efficiency.

How can I solve the challenges of settling and agglomeration of materials in electronic formulations?

FlackTek™ effectively addresses the challenges of settling and agglomeration in electronic formulations. Its high shear dual asymmetric mixing results in thorough dispersion, preventing the settling of conductive fillers and additives over time. By achieving uniform dispersion and breaking down agglomerates, FlackTek™ helps maintain the stability, reliability, and performance of electronic formulations throughout their lifespan.

Can FlackTek™ accommodate the mixing of dissimilar materials, such as incompatible resins and fillers, in electronic formulations?

Yes! FlackTek™ is suitable for mixing dissimilar materials commonly encountered in electronic formulations. The centrifugal mixing action creates a dynamic process that facilitates the blending and dispersion of materials with varying densities, leading to uniform distribution throughout the formulation. As a result, the FlackTek™ eliminates density-related inconsistencies and produces high-quality electronic materials.

Talk to us about your process

Tell us what you are mixing and we will come back with a recommendation — machine, cup and programme.

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Put a FlackTek to work on your electronics process.

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